Printed electronics

In the first quarter of 2019, Cicor opened a technology center for printed electronics at the Bronschhofen site in Switzerland and will invest around CHF 1.5 million in further expansion over the next two years. Within the technology center, a team of application engineers takes care of application development.
The increasing number of electronic devices in more and more applications requires new manufacturing technologies to be developed and industrialized. Flexible additive manufacturing processes play a key role in substrate manufacturing and connection technology.
The unique printing technology used, enables a wide range of conductive, non-conductive and biocompatible materials to be printed on a wide range of substrates and forms. In addition, new opportunities exist for interconnect technologies that can lead to performance improvements and cost optimization.
The integration of the circuits into three-dimensional surfaces often eliminates the need to use an additional substrate. Compared to the methods used today to produce such three-dimensional circuit carriers, the technology chosen by Cicor offers a significantly wider variety of printed and printable materials. Devices for medical, aerospace and IoT applications can be significantly reduced in size by using this technology.
With the opening of a technology center for printed electronics in Bronschhofen, Cicor is underlining its ambition to become the technology leader and its claim to be able to offer customers new, innovative solutions in addition to proven technologies.


Technical capabilities

  • Lines/spaces down to 10 μm
  • Printing thickness from < 100 nm to tens of μm
  • Large material portfolio (conductive, non-conductive, resistors, biocompatible, photoresist, etc.)
  • Printing on standard materials
  • Efficient printing process

Possible applications

  • Printed flex and rigid circuits
  • Printed embedded passives
  • Printed circuits on ceramics (2D + 3D)
  • Printed circuits on plastics
  • Biocompatible circuits
  • Die stacking

For additional applications please contact our engineering department