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Microelectronic Assembly

  • Close-up of bonded bare die (microelectronic assembly)

The Cicor Group offers an extensive portfolio of packaging and interconnection technology for the manufacturing of microelectronic modules and assemblies. Several production lines are available for fully automatic and semi-automated processes.

The main focuses of the assembly technologies are:

Microelectronic assembly site

Cicor production site in Radeberg, Germany

Radeberg, Germany

Radeberg, Germany

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Our EMS team is available to answer any questions about Cicor and our solutions.