Solutions

The Cicor Group is an international electronics service provider with a wide range of products and services in the fields of printed circuit board assembly, system assembly and box building, switchgear cabinet construction, cable assembly, tool design and fabrication and plastic injection molding. Cicor offers outsourcing solutions for the development and manufacture of electronic assemblies and complete devices and systems. As a globally active company, the Group exploits synergies and offers solutions based on many years of know-how.

At the Cicor Group, more than 200 well-trained engineers work on cus­tomer projects and make the engineering department a unique selling point of the company thanks to their interdisciplinary competencies. Us­ing efficient methods and tools, they support Cicor customers in the ar­eas of hardware and software engineering, PCB layout and component selection, test engineering, tool design, printed electronics, and process and quality management throughout the entire product life cycle.

Leading companies in the medical technology and industrial sectors trust in Cicor as a production partner for high-precision plastic injection molded parts and mechanical assemblies.
Cicor supports customers with regard to tool design and fabrication through to series production of high-precision plastic parts and complete devices including electronic assemblies. The efficient cooperation of the development engineers with the production departments results in a close exchange of knowledge and technology.

Thin-film substrates are used where conventional PCB technologies cannot provide an adequate technical solution. Rigid and flexible multilayer circuits with highest resolution (10 μm) can be manufactured. Thin-film technology is using semiconductor and microsystem technologies to produce circuit carriers on ceramic or organic materials. The conductor tracks in the thick-film technology are applied by screen printing and then burned in. The use of ceramic as substrate enables highest reliability under the harshest environmental conditions. A thick-film circuit is clearly superior to the standard PCB in terms of temperature resistance and service life.

For over 55 years, Cicor has been developing and producing sophisticated flexible, rigid-flexible and rigid printed circuit boards (PCBs), from the idea, through prototypes, to large-series production. Thanks to a comprehensive expertise in multilayer boards (MLBs) and high-density interconnects (HDIs), Cicor develops innovative and reliable solutions for demanding applications in medical, aerospace and defence and industrial markets. Thin materials and line width and spacing down to 25 µm (1 mil) enable extreme miniaturization and ultra-HDI advanced solutions. DenciTec® technology opens up completely new possibilities.Innovative circuits can be produced by combining our PCB processes with our thin-film technology.

The unique printing technology used, enables a wide range of conductive, non-conductive and biocompatible materials to be printed on a wide range of substrates and forms. In addition, new opportunities exist for interconnect technologies that can lead to performance improvements and cost optimization. The integration of the circuits into three-dimensional surfaces often eliminates the need to use an additional substrate. Compared to the methods used today to produce such three-dimensional circuit carriers, the technology chosen by Cicor offers a significantly wider variety of printed and printable materials. Devices for medical, aerospace and IoT applications can be significantly reduced in size by using this technology.

Cicor offers top-tier AC/DC and DC/DC power solutions ranging from 1 W to 1.2 KW. All solutions are catering to your requirements and specialising in both medical and industrial grade solutions. Our services include engineering support, custom modifications, and full design cycle assistance, ensuring seamless integration and reliability.