Printed Electronics - Aerosol Jet Printing
State of the art electronic devices offer increased functionality and integrated sensors without increasing their size. Conventional manufacturing technologies are reaching their limits for further miniaturization. Flexible additive manufacturing processes offer significant advantages compared to conventional technologies and are opening a new chapter in miniaturization for medical, aerospace and IoT applications. Cicor uses Aerosol Jet Printing to print a wide range of conductive, non-conductive and biocompatible inks on a variety of substrate materials and 3D shapes. Aside from further miniaturization, Aerosol Jet Printing also provides the means to integrate sensors into products of any size. Even the smallest tools can be rendered smart with aerosol jet printed sensors. The direct printing of sensors, antennas, wiring or electrical elements onto products also simplifies downstream assembly processes. It offers high precision automated manufacturing instead of manual labor. By eliminating the need for additional substrates, printed electronics offers a more sustainable alternative to conventional manufacturing technologies. With the two technology centers for printed electronics in Switzerland and Singapore, Cicor underlines its ambition for technological leadership and its ambition to always be able to offer customers new and innovative solutions in addition to proven technologies.
Aerosol Jet Printing Solutions
Application examples
Technical capabilities of Aerosol Jet Printing
- Lines/spaces down to 10 μm
- Printing thickness from < 100 nm to tens of μm
- Large material portfolio (conductive, non-conductive, resistors, biocompatible, photoresist, etc.)
- Printing on standard materials
- Efficient additive process
Printed electronics sites
We are here for you
Our Printed Electronics team is available to answer any questions you may have about the Aerosol Jet Printing technology.
Downloads
- White Paper Printed Electronics
- White Paper Reliability of Printed Electronics
- White Paper Reflow Soldering of Aerosol Jet® Printed Electronics