The increasing number of electronic devices in more and more applications requires new manufacturing technologies to be developed and industrialized. Flexible additive manufacturing processes play a key role in substrate manufacturing and connection technology.
The used Aerosol Jet Printing technology enables a wide range of conductive, non-conductive and biocompatible materials to be printed on a wide range of substrates and shapes. In addition, new opportunities exist for interconnect technologies that lead to performance improvements.
The integration of the circuits into three-dimensional surfaces often eliminates the need to use additional substrates. Compared to the methods used today to produce such three-dimensional circuit carriers, the Aerosol Jet Printing technology offers a significantly wider variety of printed and printable materials. Devices for medical, aerospace and IoT applications can be significantly reduced in size by using Aerosol Jet Printing technology.
With the opening of a technology center for printed electronics in Switzerland, Cicor underlines its ambition for technological leadership and its ambition to always be able to offer customers new and innovative solutions in addition to proven technologies.
Technical capabilities of Aerosol Jet Printing
- Lines/spaces down to 10 μm
- Printing thickness from < 100 nm to tens of μm
- Large material portfolio (conductive, non-conductive, resistors, biocompatible, photoresist, etc.)
- Printing on standard materials
- Efficient printing process
Possible applications of Aerosol Jet Printing
- Printed flex and rigid circuits
- Printed embedded passives
- Printed circuits on ceramics (2D + 3D)
- Printed circuits on plastics
- Biocompatible circuits
- Die stacking