Skip to content

Hybrid Circuits

Thin-film substrates are used where conventional PCB technologies cannot provide an adequate technical solution. Rigid and flexible multilayer circuits with highest resolution (10 μm) can be manufactured. Thin-film technology is using semiconductor and microsystem technologies to produce circuit carriers on ceramic or organic materials.

The conductor tracks in the thick-film technology are applied by screen printing and then burned in. The use of ceramic as substrate enables highest reliability under the harshest environmental conditions. A thick-film circuit is clearly superior to the standard PCB in terms of temperature resistance and service life.

Portfolio

Close-up of thin-film substrate

Thin-film substrates

Thin-film substrates
Close-up of a hybrid solution, thick film

Thick-film substrates

Thick-film substrates

We are here for you

Our Hybrid Circuits team is available to answer any questions about Cicor and our solutions.