Company
Company
Company
About Us
Production Sites
Quality Management
Working at Cicor
Social Responsibility
Sustainability
Board of Directors
Management Team
Solutions
Solutions
Solutions
Overview
Engineering Services
Engineering Services
Overview
Test Engineering
Product Development
Process Engineering
Electronic Manufacturing Services
Electronic Manufacturing Services
Overview
Printed Circuit Boards Assembly
Microelectronic Assembly
Cable Assembly
Box Building
Precision Plastics
Precision Plastics
Overview
Tool Design and Fabrication
Plastic Injection Molding
3D-MID
Hybrid Circuits
Hybrid Circuits
Overview
Thin-film Substrates
Thick-film Substrates
Printed Circuit Boards
Printed Circuit Boards
Overview
Flexible PCB
Rigid-flexible PCB
Rigid PCB
DenciTec®
Printed Electronics
Markets
Markets
Markets
Medical Technology
Industrial
Aerospace & Defence
Wearables
Building Technologies
Investors
Investors
Investors
Overview
Ad-hoc announcements
Financial information
Financial information
Presentations and Webcasts
Mandatory Convertible Bond (MCB)
Share information
Significant shareholders
Corporate Governance
Analysts
Publications
Agenda
Annual General Meeting
Contact for Investors
IR Mailinglist
News & Events
News & Events
News & Events
News
Social Wall
Events
Webinars
Careers
Downloads
Contact
Skip to content
Careers
Downloads
Contact
Search
En
De
Menu
Company
Company
Company
About Us
Production Sites
Quality Management
Working at Cicor
Social Responsibility
Sustainability
Board of Directors
Management Team
Solutions
Solutions
Solutions
Overview
Engineering Services
Engineering Services
Overview
Test Engineering
Product Development
Process Engineering
Electronic Manufacturing Services
Electronic Manufacturing Services
Overview
Printed Circuit Boards Assembly
Microelectronic Assembly
Cable Assembly
Box Building
Precision Plastics
Precision Plastics
Overview
Tool Design and Fabrication
Plastic Injection Molding
3D-MID
Hybrid Circuits
Hybrid Circuits
Overview
Thin-film Substrates
Thick-film Substrates
Printed Circuit Boards
Printed Circuit Boards
Overview
Flexible PCB
Rigid-flexible PCB
Rigid PCB
DenciTec®
Printed Electronics
Markets
Markets
Markets
Medical Technology
Industrial
Aerospace & Defence
Wearables
Building Technologies
Investors
Investors
Investors
Overview
Ad-hoc announcements
Financial information
Financial information
Presentations and Webcasts
Mandatory Convertible Bond (MCB)
Share information
Significant shareholders
Corporate Governance
Analysts
Publications
Agenda
Annual General Meeting
Contact for Investors
IR Mailinglist
News & Events
News & Events
News & Events
News
Social Wall
Events
Webinars
Search
En
De
Downloads Brochures
Company
Company brochure english
Company brochure german
Solutions
Electronic Manufacturing Services
R&D services
Plastic services
Printed electronics
Hybrid circuits
Printed circuit boards
Production sites
Arad (Romania)
Batam (Indonesia)
Boudry (Switzerland)
Bronschhofen (Switzerland)
Dresden (Germany)
Gosport (United Kingdom)
Radeberg (Germany)
Singapore
Suzhou (China)
Thuan An City (Vietnam)
Ulm (Germany)
Wangs (Switzerland)
