Hybrid circuits

Thin-film substrates are used where conventional PCB technologies cannot provide an adequate technical solution. Rigid and flexible multilayer circuits with highest resolution (10 μm) are possible. Thin-film technology uses semiconductor and microsystem technologies to produce circuit carriers on ceramic or organic materials.

The conductor tracks in the thick-film technology are applied by screen printing and then burned in. The use of ceramic as substrate enables highest reliability under the harshest environmental conditions. A thick-film circuit is clearly superior to the standard PCB in terms of temperature resistance and service life.

 

Cicor Webinar:

Enhanced thin-film technology: Solution for miniaturization and increased integration density

For many applications, high integration density, a small form factor and overall miniaturization of circuits are essential. Besides the PCB based solutions, Cicor is addressing these requirements with the help of its thin-film technology. The two sister plants, in Switzerland and Germany, support also the most sophisticated design ideas and products with high resolution ceramic boards and high density multi-layer flexible circuits.

Our thin-film webinar describes the key properties of thin-film technology, with a focus on flexible circuits, and how these can help for higher integration density. Additionally, a thorough description of our newly developed chip embedding technology will be given.

Speakers:        

- Dr.Alexander Kaiser, Senior Technology Advisor, Reinhardt Microtech (Cicor site Ulm)

- Jürg Moser, Sales Director, Reinhardt Microtech (Cicor site Wangs)

We look forward to welcoming you online at one of the two dates:

  • 9 to 10 am CET on September 7, 2022
  • 18 to 19 pm CET on September 7, 2022

The webinar is free of charge and will be held in English.

Register now