Thin-film substrates are used where conventional PCB technologies cannot provide an adequate technical solution. Rigid and flexible multilayer circuits with highest resolution (10 μm) are possible. Thin-film technology uses semiconductor and microsystem technologies to produce circuit carriers on ceramic or organic materials.
The cables in the thick-film technology are applied by screen printing and then burned in. The use of ceramic as substrate enables highest reliability under the harshest environmental conditions. A thick-film circuit is clearly superior to the standard PCB in terms of temperature resistance and service life.