Microelectronic assembly

The Cicor Group offers an extensive portfolio of packaging and interconnection technology for the manufacturing of microelectronic modules and assemblies. Several production lines are available for fully automatic and semi-automated processes.

The main focuses of the assembly technologies are:

  • SMD mounting

    Two lines are available for surface mounting on flex and rigid circuit boards, thick-film and thin-film substrates, enabling the assembly of very small components from 01005 (0.2mm x 0.4mm) to large BGAs of 40mm x 40mm. Specialty is the production in the clean room. The "Cleanline" offers, in addition to pure SMD assembly, the possibility of combining standard SMD technology with gluing technologies and die-bonding technology as well as the assembly of special components and semiconductor chips. The accuracy is 7µm. COB and flipchip can be processed with dimensions starting from chip size 170µm x 170µm, chip thickness 50µm and bump size starting from 20µm.  

  • Chip assembly

    Cicor uses both gluing and soldering technologies for chip assembly. It is possible to equip chips in the cleanroom on several lines. Adhesive mounting is possible with conductive, non-conductive, thermally or UV-curing or with selectively conductive ACE adhesive. Ag-sintering or flux-free vacuum brazing (lot materials: AuSn, PbSn, SnAg, SAC) is used for power or high-frequency assemblies with high local performance.

  • Wire bonding

    In addition to flip chip assembly, wire bonding is the method of choice for highly reliable applications. For this purpose, Cicor offers a wide range of bonding methods, including ball-wedge, wedge-wedge and ribbon bonding. The diameter of the materials used ranges from 12.5µm Pt over 17µm - 50µm Au up to 20µm - 500µm aluminium.

  • Encapsulation

    Depending on the application-specific ambient conditions, various methods are available to protect the dies. Frequently used methods are plastic-based protection by means of underfill, globtop, polymer encapsulation, silicone or painting processes or a permanent hermetic seal in the ceramic or metal housing.

  • Screening / Testing / Qualification

    To ensure consistent quality and reliability, Cicor offers extensive testing and screening facilities. The combination of the above-mentioned assembly technologies with highly reliable substrates opens up extensive possibilities for the certified production of miniaturized assemblies for medical technology, complex industrial assemblies or modules for aviation and space. The processes are certified according to the standards ISO 9001, ISO 13485, EN 9100, ECSS-Q-ST-60-05/ESA PSS -01-606 and KTA 1401.

Cicor Webinar

Wire bonding: Challenges and possible solutions for changing requirements

Wire bonding is a standard process for electrical connection in packaging and interconnection technology. Applications include chip-on-board technology, power module technology, high-frequency technology and the assembly of microsystems.

In this process, an electrical connection is made by means of thin or thick wire, for which we mainly use aluminum or gold wires. Various bonding methods are used. Two typical processes are applied, thermosonic (TS) wire bonding and ultrasonic (US) wire bonding. The contact points take the form of a wedge or a ball.

The webinar will focus on technological challenges in the area of bond surfaces, analysis of bonded connections and the qualification of new bonding materials.

Speakers:         Dr. Bernd Schauwecker, Head of Engineering, RHe Microsystems (Cicor site Radeberg)
                         Boris Garkuscha, Product Engineering, RHe Microsystems (Cicor site Radeberg)

We look forward to welcoming you online at one of the two dates:

  • 9 to 10 am CET on October 12, 2022
  • 6 to 7 pm CET on October 12, 2022

The webinar is free of charge and will be held in English.

Register now