Printed Circuit Boards

For nearly 60 years, Cicor has empowered customers to create highly miniaturised electronic products through cutting-edge PCB technology. At our Boudry site in Switzerland, we specialise in Design for Manufacturing (DfM) and the production of advanced flexible, rigid, and rigid-flex PCBs, from prototypes to high-reliability series production.

Leveraging deep expertise in multilayer boards (MLBs) and high-density interconnects (HDIs), Cicor delivers innovative and reliable solutions for demanding applications in the medical, aerospace & defence, and industrial markets. State-of-the-art materials, advanced manufacturing processes and extensive know-how enable extreme miniaturisation in all dimensions, with line widths and spacing down to 25 µm.

Cicor also shares its PCB expertise through a White Paper on “Ultra High Density Interconnect Printed Circuit Boards” and an in-depth Design Manual.

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Flexible PCB

Flexible printed circuit boards offer unparalleled opportunities for 3D miniaturisation. With ultra-small bending radii and ultra-HDI capabilities, they enable the development of compact, highly integrated devices – from small medical wearables to high-performance electronics requiring superior signal integrity.

Cicor has long been a technology leader in flexible circuits, manufacturing FPCs with 1 to 8 layers using polyimide foils as thin as 12.5 µm and adhesive bond plies starting at 12.5 µm. Our advanced production environment ensures high reliability and consistency. Depending on the dielectric thickness, laser-drilled blind vias as small as 30 µm can be copper-filled in subsequent plating processes.

State-of-the-art alignment methods enable ultra-fine annular rings and precise solder mask registration, even on complex multilayer designs. Coverlays are available as an option, and all standard surface finishes can be applied, ensuring compatibility with any assembly process. High-precision laser contour cutting allows for zero-radius edges, maximising space efficiency and delivering best-in-class 3D integration.

Rigid PCB

Rigid PCBs are available in a wide range of configurations, varying in layer count, base materials, construction methods, and interconnection schemes. Cicor offers rigid PCBs with 1 to 12 layers, with a strong focus on miniaturisation across all three dimensions (x, y, and z).

To support this, we use (ultra-)thin high-end base materials with coefficient of thermal expansion (CTE) values in x and y as low as 4 ppm/K-1, minimising thermal mismatch. Boards can be built in parallel or sequential constructions. Microvias and through-holes are precisely drilled using mechanical or laser processes, and can be copper-filled to support via stacking, staggering, or via-in-pad configurations. These design options provide maximum flexibility and are essential to achieving dense, miniaturised layouts.

All standard surface finishes are available, ensuring compatibility with a broad range of assembly processes. High-precision routing and laser systems enable exact contour cutting with tight alignment tolerances. Additional options such as edge plating, castellations, controlled impedance, and both plated and non-plated cavities further extend the design and functionality of our rigid PCB offering.

Rigid-flexible PCB

Rigid-flex PCBs combine the strengths of both rigid and flexible circuits into a single solution, offering significant advantages in high-performance electronic design. By integrating interconnections directly into the circuit board, they eliminate the need for separate connectors, cables, and standalone flex or rigid boards. This consolidation simplifies the assembly, enhances system reliability, and reduces the overall footprint, allowing for compact and three-dimensional installation of assembled PCBs.

In addition to space savings, rigid-flex PCBs significantly improve reliability, especially in harsh environments subject to vibration, acceleration, or deceleration, where traditional mechanical connections may fail. The integrated design also supports enhanced signal integrity by reducing the number of interfaces and potential points of failure. Furthermore, combining multiple board elements into one rigid-flex solution minimises logistic complexity and reduces the number of components that need to be managed.

Cicor offers a broad range of rigid-flex PCB constructions, employing high-end base materials such as high-Tg, low-CTE FR4 in combination with polyimide foils and a variety of adhesives. Advanced interconnection technologies, including stacked and staggered microvias as well as via-in-pad structures, enable further miniaturisation and design flexibility. A comprehensive portfolio of surface finishes ensures compatibility with all standard assembly methods, providing Cicor customers with fully integrated and reliable solutions for demanding applications.

DenciTec®

Introduced in 2016, Cicor's DenciTec^® manufacturing technology enables the production of ultra-high-density circuits without compromising on quality, reliability, or design flexibility. Built on state-of-the-art equipment and innovative base materials, DenciTec® supports next-level miniaturisation, meeting the growing demands of advanced electronic applications.

With line widths and spacings as narrow as 25 µm and copper thicknesses of 20 µm ±5 µm consistently across all layers, DenciTec^® delivers exceptional precision. Laser-drilled vias can reach diameters as small as 30 µm, while annular rings can be reduced to 30 µm for inner layers and 20 µm for outer layers. The process supports copper-filled blind vias, enabling via stacking and via-in-pad structures, further enhancing circuit density. Even ultra-thin constructions are achievable – for instance, four-layer flex circuits with a 12.5 µm polyimide core can be manufactured to be less than 120 µm thick.

DenciTec^® allows for maximum reliability and greater design freedom, enabling smaller devices and freeing up internal volume for additional features such as energy supply. Compared to semi-additive processes, DenciTec^® also offers improved manufacturing efficiency, making it a leading solution for high-end miniaturised electronics.