3D-MID technology

Cicor’s 3D-MID solutions combine mechanical precision with electronic functionality, enabling true miniaturization and integration in high-performance devices. By merging structure and circuitry, customers benefit from fewer interfaces, simplified assembly, and enhanced reliability.

Using laser activation and selective metallization, conductive tracks are applied directly onto molded plastic structures, allowing exceptional design freedom and high functional density within compact spaces.
Cicor offers the complete in-house process chain — from tool design and molding to laser structuring, metallization, and assembly — ensuring full control, consistent quality, and seamless integration into serial production.

Our end-to-end process guarantees validated quality and short development cycles. Manufacturing under the same certified quality systems as Cicor’s EMS and plastics operations ensures consistent performance even in demanding environments. Located in Suzhou (China), our 3D-MID facility is fully integrated into Cicor’s global manufacturing network, enabling smooth collaboration and reliable scale-up from prototype to mass production.
 

Advantages

• Integration of mechanical and electrical functions
• Significant size and weight reduction
• Simplified assembly and logistics
• Enhanced reliability through fewer interfaces
• Ideal for wearables, medical, and sensor applications
• In-house tool design and molding capabilities that accelerate project realization and enhance CDMO and final-device assembly programs