Radeberg, Germany
Your Microelectronics Assembly and Thick-Film Expert
The site in Radeberg is specialised in the manufacture of complex substrates using thick-film technology. It also assembles microelectronics on ceramic or printed circuit boards.
- Founded in 1991, the site Radeberg offers a range of services, including development support, prototyping, volume production, and product qualification.
- A variety of advanced packaging technologies are used in clean room production, such as chip bonding, wire bonding, vacuum soldering, sintering, SMD assembly, and various encapsulation processes. Functional test stations are designed and built in-house, ensuring high-quality testing and reliability.
- The facility includes 1,300 m² of clean rooms, with classifications up to ISO Class 5 (Class 100) for precision manufacturing.
- The core industries are aerospace & defence, medical and demanding industrial applications.
- The site Radebergf is certified to industry standards, holding ISO 14001, ISO 9001, and ISO 13485 certifications. The site is also EN 9100 Aerospace and KTA 1401 Nuclear power plants certified.
Expertise and Services
Microelectronic Assembly
At the Cicor site in Radeberg, we offer a wide range of high-precision manufacturing technologies for assembling microelectronic components. The focus is on processing a variety of substrates (such as printed circuit boards, flex, ceramics and leadframes) and ensuring the maximum traceability of all components used.
Technologies employed include modern processes such as COB (chip-on-board), flip chip, reflow and vacuum soldering, and Ag sintering. Die attachment processes are carried out using either adhesive bonding or solder-free vacuum soldering.
Connection technologies include ball-wedge, wedge-wedge and ribbon wire bonding. Highly miniaturised components of up to size 01005 and area arrays (e.g. BGAs) are employed in SMT production.
To ensure the highest quality standards, automatic inspections of the solder paste and assembly are carried out using AOI. Further process steps include hermetic encapsulation (seam welding and soldering), separation processes such as laser cutting and wafer dicing, and marking using lasers and 3D printing. Thick-film technology is also used for special requirements.
This comprehensive technology platform enables the Cicor site in Radeberg to implement sophisticated microelectronic solutions for markets such as medical technology, industry and aerospace and defence.
Thick-Film Substrates
The Radberg site specialises in processing ceramic, steel and glass substrates for thick-film technology. Its expertise includes screen printing of conductive and resistive pastes, achieving structural resolutions of up to 80 µm (line/space). The surfaces are refined for solderable and bondable applications, resulting in a high degree of versatility. In addition, the site offers the adjustment of active and passive resistors using precision laser technology for optimum performance.
More about Thick-film Substrates at Cicor
Test Engineering
To ensure the quality and reliability of its products, the Radeberg site offers a wide range of testing services. These include flying probe tests as well as temperature change and humidity tests. Burn-in, acceleration and vibration tests as well as leak and X-ray tests are also carried out to simulate real-world conditions. In addition, in-circuit tests and electrical tests are offered for detailed diagnostics, as well as endurance tests to evaluate long-term performance.
Contact
Contact us
RHe Microsystems GmbH
Heidestrasse 70
01454 Radeberg
Germany
Work with us
Do you value open communication and short official channels? Is it important to you to work in a financially stable company with a long tradition? Are you looking for a familiar working atmosphere and at the same time appreciate professional company processes? Do you want to be a personality for your employer and not just a number? Then we invite you to get to know us better.
