DenciTec® enables the production of very high-density circuits. Optimum use is made of the unique manufacturing equipment, which makes it possible to produce circuits with a high degree of reliability and without constraints in terms of the design.
DenciTec® makes further miniaturization possible. Possibilities include line widths and spacings down to 25 μm (1 mil) with copper thicknesses of 20 μm (0.8 mil) +/- 5 μm on all conductive layers, laser-via diameters of 30 μm (1.2 mil), annular rings of 30 μm (1.2 mil) for the inner layers and 20 μm (0.8 mil) for the outer layers, copper-filled blind vias with the option of via stacking and vias-in-pads. Moreover, the use of state-of-the-art materials enables the production of ultra-thin circuits, for example the manufacturing of 4-layer flex circuits less than 120 µm (4.7 mil) thick.