DenciTec

DenciTec® enables the production of very high-density circuits. Optimum use is made of the unique manufacturing equipment, which makes it possible to produce circuits with a high degree of reliability and without constraints in terms of the design.

DenciTec® makes further miniaturization possible. Possibilities include line widths and spacings down to 25 μm (1 mil) with copper thicknesses of 20 μm (0.8 mil) +/- 5 μm on all conductive layers, laser-via diameters of 30 μm (1.2 mil), annular rings of 30 μm (1.2 mil) for the inner layers and 20 μm (0.8 mil) for the outer layers, copper-filled blind vias with the option of via stacking and vias-in-pads. Moreover, the use of state-of-the-art materials enables the production of ultra-thin circuits, for example the manufacturing of 4-layer flex circuits less than 120 µm (4.7 mil) thick.

  • More freedom in design – greater functionality for equipment
    • Miniaturization: Significantly greater integration capabilities: More space for additional options such as energy supply (batteries, etc.)
    • Higher packing density: More design options, no limitations in the use of design features
    • Greater functionality: Smarter products with more functions
    • Significantly lower manufacturing costs than with thin-film technology
  • The revolution in miniaturization

    DenciTec® enables the production of very high-density circuits without the disadvantages of standard manufacturing processes:

    • A unique combination of production processes on state-of-the-art equipment
    • New possibilities in the production of printed circuit boards, high-reliability circuits with no restrictions in terms of design
    • Production output and yield are in line with the typical values for PCB manufacturers
  • New possibilities in miniaturization
    • Line widths and spacings down to 25 µm (1 mil)
    • Copper thicknesses of 20 µm (0.8 mil) +/- 5 µm on all layers
    • Laser-via diameters of 35 µm (1.4 mil)
    • Annular rings of 30 µm (1.2 mil) for the inner layers and 20 µm (0.8 mil) for the outer layers
    • Copper-filled blind vias with the option of via stacking and vias-in-pads
    • Even ultra-thin circuits are possible, using a 12.5 µm (0.5 mil) polyimide core material (4-layer flex circuits less than 120 µm (4.7 mil) thick)
    • Maximum reliability