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  • Close-up of PCB with Cicor's DenciTec technology

Since 2016 Cicor has been offering DenciTec® PCBs. Highly sophisticated manufacturing technologies are enabling the production of very high-density circuits. State of the art equipments and new kinds of base-materials are making sure, that no concessions have to be made for Qality and design freedom..

DenciTec® makes further miniaturization possible:

  • Line widths and spacings down to 25 µm (1 mil)

  • Copper thicknesses of 20 µm (0.8 mil) +/- 5 µm on all layers

  • Laser-via diameters of 30 µm (1.4 mil)

  • Annular rings of 30 µm (1.2 mil) for the inner layers and 20 µm (0.8 mil) for the outer layers

  • Copper-filled blind vias with the option of via stacking and vias-in-pads

  • Even ultra-thin circuits are possible, using a 12.5 µm (0.5 mil) polyimide core material (4-layer flex circuits less than 120 µm (4.7 mil) thick)

  • Maximum reliability

More freedom in design – greater functionality for equipment:

  • Miniaturization: Significantly greater integration capabilities: More space for additional options such as energy supply (batteries, etc.)

  • Higher packing density: More design options, no limitations in the use of design features

  • Greater functionality: Smarter products with more functions

  • Significantly lower manufacturing costs than with thin-film technology

PCB site

Cicor production site in Boudry Switzerland

Boudry, Switzerland

Boudry, Switzerland

We are here for you

Our PCB team is available to answer any questions about Cicor and our solutions.