Ways to Protect Electronics
from Environmental Influences
Protection mechanisms at chip level, for PCBs and complex assemblies
Electronic assemblies are generally at risk from environmental influences such as humidity, mechanical stress, temperature changes, corrosive chemicals, etc.
Various protective measures can be used to increase operational safety, including conformal coatings, potting, glob top, underfilling and others.
The webinar will provide an overview of the principles of action, as well as areas of application and selection criteria for these types of protection, considering normative requirements and current technological developments.
The aim is to efficiently evaluate and implement suitable protection strategies for different application scenarios.
Thursday, 26 March 2026
9 and 10 a.m. CET
The webinar is free of charge and will be held in English.
Agenda
| Time | |
| 09:00 | Welcome and introduction |
| 09:10 | Protection mechanisms at chip level, for PCBs and complex assemblies |
| 09:30 | Q&A Session (English and German) |
If you have specific questions you would like answered during the webinar, please share them with us here.
