Company
Company
Company
About Us
Corporate Responsibility
Quality Management
Board of Directors
Management Team
Solutions
Solutions
Solutions
Overview
Engineering Services
Engineering Services
Overview
Test Engineering
Product Development
Process Engineering
EMC Lab
Electronic Manufacturing Services
Electronic Manufacturing Services
Overview
Printed Circuit Boards Assembly
Microelectronic Assembly
Cable Assembly & Wire Harness
Box Building
Precision Plastics
Precision Plastics
Overview
Tool Design and Fabrication
Plastic Injection Molding
3D-MID
Hybrid Circuits
Hybrid Circuits
Overview
Thin-film Substrates
Thick-film Substrates
Printed Circuit Boards
Printed Electronics
Power Supply
Prototyping
Markets
Markets
Markets
Technologies de la santé
Industrie
Aérospatial et Défense
Locations
Locations
Locations
Overview
Africa
Africa
Morocco
Africa
Berrechid
Témara
Tunisia
Africa
Borj Cedria
Asia
Asia
China
Asia
Dongguan
Suzhou
Indonesia
Asia
Batam
Singapore
Vietnam
Asia
Ho Chi Minh City
Europe
Europe
Germany
Europe
Dresden
Radeberg
Suhl
Wutha-Farnroda / Buttlar
France
Europe
Angers
Combrée
Douarnenez
Neuilly-en-Thelle
Saint-Agrève
Romania
Europe
Arad
Bucharest
Sweden
Europe
Norrtälje
Switzerland
Europe
Boudry
Bronschhofen / Plan-les-Ouates
Wangs
United Kingdom
Europe
Newport
Bedford
Gosport
Hartlepool
Investors
Investors
Investors
Overview
Ad-hoc announcements
Key Figures
Financial information
Financial information
M&A Activity Overview
OEP Tender Offer
Mandatory Convertible Bond (MCB)
Share information
Significant shareholders
Corporate Governance
Analysts
Publications
Presentations
Financial Calendar
Annual General Meeting
Contact for Investors
IR Mailinglist
News & Events
News & Events
News & Events
News
Social Wall
Events
Webinars
Careers
Downloads
Contact
myCicor
Passer au contenu
Careers
Downloads
Contact
myCicor
Recherchez
En
De
Fr
Menu
Company
Company
Company
About Us
Corporate Responsibility
Quality Management
Board of Directors
Management Team
Solutions
Solutions
Solutions
Overview
Engineering Services
Engineering Services
Overview
Test Engineering
Product Development
Process Engineering
EMC Lab
Electronic Manufacturing Services
Electronic Manufacturing Services
Overview
Printed Circuit Boards Assembly
Microelectronic Assembly
Cable Assembly & Wire Harness
Box Building
Precision Plastics
Precision Plastics
Overview
Tool Design and Fabrication
Plastic Injection Molding
3D-MID
Hybrid Circuits
Hybrid Circuits
Overview
Thin-film Substrates
Thick-film Substrates
Printed Circuit Boards
Printed Electronics
Power Supply
Prototyping
Markets
Markets
Markets
Technologies de la santé
Industrie
Aérospatial et Défense
Locations
Locations
Locations
Overview
Africa
Africa
Morocco
Africa
Berrechid
Témara
Tunisia
Africa
Borj Cedria
Asia
Asia
China
Asia
Dongguan
Suzhou
Indonesia
Asia
Batam
Singapore
Vietnam
Asia
Ho Chi Minh City
Europe
Europe
Germany
Europe
Dresden
Radeberg
Suhl
Wutha-Farnroda / Buttlar
France
Europe
Angers
Combrée
Douarnenez
Neuilly-en-Thelle
Saint-Agrève
Romania
Europe
Arad
Bucharest
Sweden
Europe
Norrtälje
Switzerland
Europe
Boudry
Bronschhofen / Plan-les-Ouates
Wangs
United Kingdom
Europe
Newport
Bedford
Gosport
Hartlepool
Investors
Investors
Investors
Overview
Ad-hoc announcements
Key Figures
Financial information
Financial information
M&A Activity Overview
OEP Tender Offer
Mandatory Convertible Bond (MCB)
Share information
Significant shareholders
Corporate Governance
Analysts
Publications
Presentations
Financial Calendar
Annual General Meeting
Contact for Investors
IR Mailinglist
News & Events
News & Events
News & Events
News
Social Wall
Events
Webinars
Recherchez
En
De
Fr
Login
Nom d'utilisateur
Mot de passe
Mot de passe oublié ?
Vous n'êtes pas encore inscrit ?
Demandez votre identifiant personnel
