Rigid-flex printed circuit boards

Combining the advantages of both, rigid and flexible PCBs in one circuit board offers several benefits:

  • Replace rigid PCBs, connectors, cables or separate flexible circuit boards by integrating the connection of different parts in one single rigid-flex PCB
  • Reduce the size of components and enabling 3-dimensional installation of assembled PCBs
  • Increase reliability, especially in harsh environments including vibration, acceleration or deceleration, as connection is integrated in the circuitry
  • Improved signal integrity
  • Reduce logistic effort by combining several components within one single PCB

Cicor is offering a big variety of rigid-flex PCB constructions, using high end/quality base materials, like high TG/low CTE FR4, combined with polyimide foils and various adhesives. State of the art interconnection technologies like stacked or staggered vias and via-in-pad structures are used to drive miniaturization further down the road. A big portfolio of surface finishings is enabling Cicors customers to use all available assembly methods on boards produced by us.

Expertise and technical support, combined with state-of-the-art equipment enables Cicor to offer printed circuit boards, that meet and even exceed costumers requirements.

  • Capabilities
    • Flexible, rigid-flexible and rigid PCBs
    • High-density interconnects (HDIs)
    • Multi-chip modules (MCMs)
    • 1-20 layer rigid PCBs
    • Multilayer circuits on polyimide, polyimide glass, LCP, FR-4, high-Tg, HF substrates
    • Panel production
    • Circuit board structures down to 25/25 μm (1/1 mil)
    • Laser microvias down to 30 μm (1.2 mil) diameter
    • Mechanical vias down to 75 μm (3 mil) diameter
    • Copper filled blind vias
    • Stacked/staggered microvias
    • Thin base materials down to 12.5 μm (0.5 mil)
    • Maximum board thickness 3.0 mm (0.12 in)
    • Laser cavities
    • Materials for temperature management
    • Extensive portfolio of surface finishes 
      • Immersion Sn
      • Immersion Ag
      • ENIG
      • ENEPIG
      • OSP
      • Galvanic Ni/Au
      • HASL