Cicor Technologies Ltd. wins major project for thin-film substrates manufacturing

Boudry, December 4, 2018 – Cicor (SIX Swiss Exchange: CICN), a leading international technology company in the field of printed circuit boards, microelectronics and EMS (electronic manufacturing services), headquartered in Boudry (Switzerland), can announce today that it has won a major project to run for several years.

The supply agreement for manufacturing thin-film substrates, with an expected total volume of over CHF 20 million, was concluded with a well-known European aerospace company. The individual orders and substrate manufacturing will be realized between 2019 and 2024 at the Cicor production sites for thin-film substrates.

With two thin-film technology factories at its Wangs (Switzerland) and Ulm (Germany) sites, Cicor is the market leader in Europe and one of the most important manufacturers worldwide. Thin-film technology uses semiconductor and microsystem technology processes to produce highly miniaturized circuit boards. The extreme miniaturization of electronic components is particularly vital in the fields of medical technology, aerospace and communication technology (5G mobile networks) and promises further significant growth for the AMS Division over the next few years.

In addition, Cicor can confirm the positive development of the company for the whole of 2018. Cicor expects results to be at the upper end of the previous guidance for high single-digit percentage in sales growth, with an operating margin (EBIT) of between 5% and 6% of sales.

Contact

Alexander Hagemann                                       Patric Schoch
CEO                                                                 CFO
Phone +41 71 913 73 00                                  Phone +41 71 913 73 00

Email: media@cicor.com                                 Email: media@cicor.com

 

Cicor Management AG
Gebenloostrasse 15
9552 Bronschhofen
Switzerland