YAVNE, ISRAEL, NOVEMBER 20, 2014 | ORBOTECH LTD. Orbotech announced today that Cicor Technologies Ltd., an industrial group active in advanced microelectronic, substrates and electronic solutions, has chosen Orbotech’s Paragon™ Ultra 300 laser direct imaging (LDI) system for its production site Cicorel SA in Boudry, Switzerland.
With the Paragon™ Ultra 300 LDI system, Cicor is able to offer its clients the highest level of equipment to support their advanced production process.
Commenting on the announcement, Mr. Pascal Keller, Executive Vice President of the Cicor Advanced Microelectronics & Substrates Division stated, “We were searching specifically for an LDI solution capable of exposing a sub 10µmline at extremely high quality and forasolution that could expose panels with high energy, up to 800 mJ/cm², with no trade off in throughput. Once again, only Orbotech’s technology matched our requirements. This best-in-class system supports our technological leadership and enables Cicor to develop innovative products that will prevail in their various applications.”
Cicor is a long-time customer of Orbotech and we are pleased that once again, Orbotech is able to provide the best-in-class technology to help expand our customers’ business,” said Mr. Hadar Himmelman, President of Orbotech West. “Our Paragon Ultra 300 LDI truly offers leading resolution and throughput and we are proud that only our system was able to meet Cicor’s strict production demands.”
About Paragon™ Ultra 300
Featuring the leading-edge performance of Orbotech’s Large Scan Optics (LSO) Technology™, Paragon™ Ultra 300 Laser Direct Imaging (LDI) system delivers the highest imaging accuracy and yields for today’s most complex IC substrate applications including Flip-Chip BGA, Flip-Chip CSP, BGA/CSP and modules manufacturing. It provides fast throughput using enhanced electronics and a powerful laser system and provides exceptional results on both conventional UV and LDI resists.
Cicor is a globally active group of leading companies in the electronics industry. It is organized into two Divisions: Advanced Microelectronics & Substrates (AMS) and Electronic Solutions (ES). The Group's companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, 3D-MID solutions, hybrids and electronic modules. With around 1900 employees at eleven production sites worldwide, the Group supplies high-quality customized solutions to clients in Europe, the US and Asia. The shares of Cicor Technologies Ltd. are listed on the SIX Swiss Exchange (CICN). For further information, please visit our website www.cicor.com.
About Orbotech Ltd.
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Today, virtually every electronic device is produced using Orbotech technology. For more information visit www.orbotech.com