CERN LHCb experiment


Advanced Microelectronics & Substrates

Tiny atomic particles are investigated at LHCb Experiment (Large Hadron Collider Beauty Experiment) at the world's largest particle accelerator at CERN. We are producing several sensor modules using highly sophisticated microassembly technology.

  • Manufacturing of LHCb Silicon Tracker Module and TT Hybrid
  • AlN thick film carrier
  • Thin film substrates with min. lines and spaces 12 μm
  • SMD assembly
  • Die Attach
  • 800 3D wire bonding connections staggered in 4 rows, pitch 40 μm