Microelectronic Assembly

Cicor provides cutting-edge SMD assembly for flexible and rigid circuit boards, as well as thick- and thin-film substrates. Production takes place in ISO-certified cleanroom environments (Classes 5 to 8), which support the highest levels of cleanliness, reliability and precision. Our 'Cleanline' technology not only enables high-accuracy SMD mounting with component sizes down to 01005 (0.2 mm x 0.4 mm), but also advanced hybrid assembly, combining gluing technologies, die bonding and semiconductor integration.

With an assembly accuracy of 7 µm, Cicor can reliably process large BGAs (up to 40 mm × 40 mm) and extremely small chips (down to 170 µm × 170 µm) with bump sizes starting from just 20 µm.

Cicor ensures precise and application-specific chip assembly, whether via gluing or soldering. Depending on performance and reliability requirements, conductive and non-conductive adhesives, thermally or UV-curing compounds, and ACE selectively conductive adhesives are used. For power and high-frequency applications, Cicor uses advanced processes such as silver sintering and flux-free vacuum brazing with materials like AuSn, PbSn, SnAg and SAC.

Cicor offers a comprehensive selection of wire bonding solutions, including ball-wedge, wedge-wedge and ribbon bonding. We use materials ranging in thickness from 12.5 µm platinum to 500 µm aluminium. This flexibility enables us to address a wide variety of applications, ranging from ultra-miniaturised medical implants to mission-critical aerospace modules. Wire bonding remains the method of choice where long-term reliability is paramount.

Die protection is crucial in challenging environments. Cicor provides various encapsulation options, including underfill, glob top, polymer, silicone and conformal coating, as well as hermetic sealing in ceramic or metal packages. Our broad capabilities ensure that each assembly is protected to match the environmental and performance requirements of the end application.