[Translate to deutsch:]
The demands placed on medical applications are high: their reliability and functionality must be guaranteed at all times while designs keep becoming smaller, more flexible and more complex. For implants that come in contact with human tissue in particular biocompatibility must always be ensured.
Cicor manufactures complex circuits of various materials and realizes ultrafine structures, which can be less than 0.02 mm thick despite having a high functional density. Using CiP (chip in polymer/plastic) technology, the overall thickness of chip packages can be reduced to between 60 and 100 μm. State-of-the-art technology now makes it possible to manufacture multilayer circuits from biocompatible materials or stretchable components in conjunction with multilayer technology on flexible substrates.