Cicor – Erfolgreiche Einführung der 3D-MID Technologie

Cicor has secured a number of orders in the field of 3D-MID technology. March 2011 saw Cicor drive this key pioneering technology with the inauguration of a technology centre at its headquarters in Boudry, Switzerland; the company is now harvesting successes from its endeavours in the market.

One of the projects is a medical technology application that secures the connectivity of the device/system in its high-tech environment. The Cicor 3D-MID solution delivers a 40% reduction in volume and a 70% reduction in weight compared to the best existing conventional solution. Another project is in the field of security/data protection. This particular application concerns a high-security enclosure designed to protect sensitive data against unauthorised access.
Cicor's 3D-MID solution delivers enhanced protection compared to conventional PCB solutions and meets the latest PCI PTS POI V3 standard (Payment Card Industry/PIN Transaction Security/Point of Interaction Version 3).

Further projects in the areas of medical technology, automotive engineering, security technology and 3D antennae are at an advanced stage of development. Implementation of these 3D-MID technology applications delivers greater miniaturisation and cost reductions and facilitates the integration of additional functions.


Contact:
Antoine Kohler
Chairman of the Board of Directors
Tel. +41 43 811 44 05 
E-mail: media@cicor.com

Dr. Roland Küpfer
CEO
Tel. +41 43 811 44 05
Email: media@cicor.com

Cicor Management AG
Leutschenbachstrasse 95
8050 Zurich Switzerland