Radeberg, Germany

The Cicor location in Radeberg (RHe Microsystems GmbH) is specialized in the production of complex substrates in thick-film technology as well as microelectronic assembly on ceramics or PCBs. Its core industries are aerospace, military, medical and demanding industrial applications. The site's range of services includes development support, prototype construction, serial production and industry-specific product qualifications. The testing stations for functional tests in series production are developed and set up internally. This approach ensures that even the most demanding quality requirements are met.

The production site has 1300 m² of clean rooms up to class ISO 5 (class 100). Under these conditions, very sensitive optical components such as those used in high-resolution cameras for wafer production are also processed. The sterile production of medical devices is carried out in a separate area in the clean room, as is the processing of silicone. Two fully automatic lines are available for the assembly of dies and SMD components, which also enable mixed assembly on a substrate. The manufacturing accuracy is up to 7 µm. Soldering, bonding, sintering and various wire bonding processes are available as joining technologies. Various encapsulation processes up to hermetic housings complete the capabilities of the production site.

Products & Services

Thick-film substrates

Microelectronic assembly

News

  • 02/2019 - Mechanical quality control with pull/shear tester

    In January 2019, the Cicor site in Radeberg acquired a new pull and shear tester for mechanical testing of the strength of electronic packaging superstructures. The "Condor Sigma" device from XYZTEC offers both manual and automated testing of assembled polymer printed circuit boards and ceramic substrates, as well as on package assemblies. These are mainly tests for daily quality monitoring of thin/thick wire bond connections and joint strengths of soldered and bonded components.

  • 10/2018 - Optical inspection with AOI

    The Radberg site installed an automatic optical inspection unit in Sommer 2018. The device of the series Advanced Line from Göpel Electronic will mainly be used for solder joint inspection of SMD components, the control of coating coating and the inspection of printed circuit board structures. An input station with two magazine handling and an output station with good/bad sorting allow an automatic inspection operation without permanent employee presence. The handling of ceramic substrates or printed circuit boards up to dimensions of 300 mm x 400 mm is easily possible. Thin printed circuit boards up to 300 μm thickness can also be processed. The inspection unit can also be automatically loaded with unusual formats, such as 50 mm x 500 mm.

  • 11/2017 - New X-ray system

    In November 2017, the Radeberg (DE) site commissioned a new X-ray facility. The device is able to carry out detailed investigations of components and connection setup with an image quality not possible before. The results help both in setting up demanding soldering processes and in securing quality standards.

  • 09/2017 - SMD assembly line

    A new SMD placement machine from Juki was installed in September 2017. The machine significantly increases the throughput of the existing line and thus creates new capacity for the targeted growth. Simultaneously with the installation, the automatic recognition of components and batches was implemented, which allows the allocation of each individual component based on the serial number of the product. This meets the requirements of medical technology for component traceability.

    In January 2019, the Cicor site in Radeberg acquired a new pull and shear tester for mechanical testing of the strength of electronic packaging superstructures. The "Condor Sigma" device from XYZTEC offers both manual and automated testing of assembled polymer printed circuit boards and ceramic substrates, as well as on package assemblies. These are mainly tests for daily quality monitoring of thin/thick wire bond connections and joint strengths of soldered and bonded components.

  • 04/2017 - Thin wire bonder

    In April 2017, a new fully automatic wire bonder from the renowned manufacturer Hesse was put into operation at the Radeberg (DE) site. The Bondjet with a wedge-wedge bond head processes Al wire with a diameter of 17.5 µm to 50 µm and replaces an older device. Thanks to this investment, the processing speed was significantly increased and the quality of the bonds was further improved. RHe believes that wedge-wedge technology will continue to be an important component of joining technology in the future.

  • 03/2017 - ISO 13485 Certification

    The Cicor site in Radeberg (DE) has been working successfully with customers from the medical technology sector for more than 10 years. In order to achieve further growth in this strategically important area, the company was certified according to DIN EN ISO 13485 in March 2017. All areas of the company were audited. The successful completion of the certification audit focused in particular on recording, documenting and evaluating the process stability of the assembly process.