PCBs

  • Flexible, rigid and rigid-flexible PCBs
  • High-density interconnects (HDIs)
  • Multi-chip modules (MCM)
  • 1-32 layer rigid PCBs
  • Multilayer circuits on polyimide, polyimide glass, LCP, FR-4, high-Tg, HF substrates
  • Panel and reel-to-reel production
  • Circuit board structures down to 25/25 μm
  • Laser microvias down to 30 μm diameter
  • Mechanical vias down to 75 μm diameter
  • Copper filled blind vias
  • Stacked/staggered microvias to 6-n-6
  • +/-5% impedance-controlled circuit boards
  • Thin base materials down to 12.5 μm
  • Maximum board thickness 4.0 mm
  • Laser cavities
  • Materials for temperature management
  • Extensive portfolio of surface finishes
    • Immersion Sn
    • Immersion Ag
    • ENIG
    • ENEPIG
    • OSP
    • Galvanic Ni/Au
    • HASL