Packaging

For the use of electronic components in special applications Cicor offers a wide range of packaging solutions. Hermetically sealed housings are sealed by a seam welding process, under a nitrogen atmosphere. Then the tightness of the housing is examined by gross and fine leak test. A weight-saving alternative to complete packaging is the hermetic sealing of parts of thin and thick-film circuits.

  • Circuit protection (passivation, glob-top, conformal coating etc.)
  • Hermetic housing (metal, ceramic)
  • MEMS/RF MEMS packaging
  • Customized packaging solutions