Production site Radeberg, Germany

Advanced Microelectronics & Substrates Production site Radeberg, Germany

RHe Microsystems GmbH is equipped with the latest in assembly and inter connect technology and is specialized in the manufacture of highly complex substrates in thick-film technology and micro assembly. RHe Microsystems GmbH covers the entire value chain from design to fully tested and certified product. The products are highly reliable and can withstand even the harshest conditions.

The production site has more than 900 m² of cleanrooms up to class ISO 5 (class 100), enabling it to process highly sensitive optical components. The fully automatic and manual SMD assembly (down to SMD 01005) and chip-and-wire line also allow the microassembly of highly sophisticated substrates. Customer-specific packaging solutions round off the technological spectrum.

Competencies and services

Cleanrooms from class ISO 8 to ISO 5 (class 100,000 to 100), 900 m²


Fully and partly automatic bonding machines

  • Thin-wire bonding
    • Ultrasonic (wedge/wedge)
    • Thermosonic (wedge/wedge, ball/ wedge)
  • Thick-wire bonding
    • Ultrasonic (wedge/wedge)
    • Ribbon bonding
    • Thermosonic (wedge/wedge)
  • Beam lead bonding
  • Thermosonic
  • Die bonding
  • Flip chip bonding

Fully automatic and manual SMD assembly line

  • Die attach, COB, flip chip, chip, MMICs, SMD (min. 01005), («)BGA
  • Chip and wire
  • 3D-MID assembly


  • Seam welding machine (hermetic packaging)
  • Circuit protection (passivation, glob top, paint coating, etc.)
  • MEMS/RF MEMS packaging
  • Vacuum and reflow soldering kiln