Innovation Insights - Technical White Papers

Mon, 05 Dec 2016

Cicor published a new White Paper: "Ultra High Density Interconnect Printed Circuit Boards"

 

Cicor white papers provide additional, in-depth technical information on technologies and services. Furthermore you will find details of manufacturing processes, areas of application and solutions, competent explanations and information about scientific backgrounds.

New White Paper: "Ultra High Density Interconnect Printed Circuit Boards"

Abstract:
PCB manufacturers have been using different technologies for the production of printed circuits. Historically, the two methods panel plating and pattern plating have been used for many decades. Both of the methods have their pro’s and con’s and their clear limitations. For circuits with line widths and spacings of less than 35 microns, several concessions have to be made to achieve acceptable results and output. The currently used production process is typically not enabling the use of the whole set of possibilities of modern PCB technology, e.g. for example via stacking, via in pad structures or integrated antenna.
 

White Papers