Wafer sawing

DICING SERVICE FOR WAFERS UND CERAMICS

Materials

• aluminium oxide
• aluminium nitride
• PZT-ceramics
• quartz glass
• glass
• silicon
• other material on request

Wafer dimensions

• max. 6"

Wafer thickness

• min. 200 µm (under it on request)
• max. 750 µm

Dicing channel

• silicon: min. 75 µm
• other: min. 100 µm

Chipping

• silicon: max. 10 µm
• other: max. 50 µm

Tape

• standard: 150 µm UV-Tape
• blue tape

Delivery form

• on tape/frame
• waffle pack

Anwendung

• rapid prototyping
• handling of small lots

REMARKS
The dicing channel should be free of metallisation. It is not possible to saw the wafer in proper form if electroplated metallization with a thickness above 1 µm exists in the dicing channel.