Thin Film Technology

SUBSTRATES

Materials

• aluminium oxide ceramics 99,6 % (Al2O3)
• aluminium nitride ceramics (AlN)
• quartz glass
• low alkali borosilicate glass
• other ceramics in compliance with customer request

Dimensions

• standard: 2" x 2" / 4" x 4"

Thickness

• ceramic substrates: 0.254, 0.381, 0.635 mm
• quartz glass: 0.178, 0.254 mm
• other thicknesses in compliance with customer request

CONDUCTORS
Materials

• TiW/Au
• TiW/Pt/Au
• TaN/TiW/Au
• TiW/Pd/Au
• CrNi/Cu

Surfaces

• electroless deposited Ni + Au on Cu
  (solderable and bondable)
• electroplated Au (bondable)
• electroless deposited Sn on Cu (solderable)
• electroplated hard gold
• sputtered Pd solder layer
• sputtered Pt solder layer

Conductor width & spacing

• min. 5 µm
• tolerance: min. ± 2 µm

RESISTORS
Materials

• CrNi (adjustable temperature coefficient)
• TaN (of high stability)

Range

• 20 ... 250 Ohm/sq

Laser trimming tolerance

• standard: < 0.5 %
• min. < 0.1 %

Temperature coefficient:

• CrNi: adjustable from - 20 to + 60 ppm/K
• TaN: - 90 ppm/K
• tracking: < 5 ppm/K

TECHNOLOGICAL POSSIBILITIES

• laser cutting, laser drilling
• seperation by sawing

DELIVERY TIME FOR PROTOTYPES
10 working days when mask dates are available inclusive masks, layer production and assembly of electronic components