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Microelectronics

Thick Film Technology

SUBSTRATES
Materials

  • aluminium oxide ceramics 96 % (Al2O3)
  • aluminium nitride ceramics (AlN)
  • beryllium oxide ceramics (BeO)
  • steel
  • other ceramics in compliance with customer request

Dimensions

  • standard: 4" x 4"
  • up to max. 6.5" x 4.5"

Thickness

  • standard: 0.635 mm, min. 0.254 mm
  • other thicknesses and shapes in compliance with customer request


CONDUCTORS
Materials

  • AgPd (Rsq ca. 30 mOhm)
  • Au (Rsq ca. 3 mOhm)
  • Ag (Rsq ca. 1.5 mOhm)
  • other conductor materials in compliance with customer request

Conductor width & spacing

  • standard: 200 µm
  • min. 80 µm


RESISTORS
Range

  • 1 ... 20 MOhm
  • other values on inquiry

Laser trimming tolerance

  • standard: < 1 %
  • min. < 0.5 %

Temperature coefficient

  • ± 50 ppm/K


NON-CONDUCTIVE LAYERS

  • dielectrics
  • overglaces
  • organic encapsulants
     

TECHNOLOGICAL POSSIBILITIES

  • multilayer
  • back side print with through holes
    (min. diameter 100 µm)
  • laser active trimming
  • combination of thick/thin film technologies


DELIVERY TIME FOR PROTOTYPES
20 working days inclusive layout, layer production, assembly of electronic components and tests

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