- Development of test processes and programs as well as test jigs according to the customer specifi cations
- Electrical tests: Complex automatic RF and microwave function tests at measuring stations up to 50 GHz
- Automatic active and passive laser trimming
- X-Ray inspection for material analysis, non-destructive testing of layer thicknesses
- X-Ray analysis for monitoring of components processing like BGA, flip chip assembly
- Pull and shear tests
- Gross and fine leak test
- Laser profi le measurement (e. g. adhesive thickness)
- Burn in test, PIND test
- Environmental tests: Temperature/humidity storage, thermal cycle and shock, vibration, acceleration, mechanical shock test
