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Microelectronics

Summary

  • Complete manufacturing of modern and complex modules, from circuit board manufacturing to assembly and interconnections up to packaging
  • Broad range of electronics packaging technologies also for mixed techniques using different components and materials in one module
  • Maximum possible accuracy and repeatability by fully automatic microassembly at short lead times
  • Delivery of tested and qualifi ed modules
  • Manufacturing of samples, prototypes and series production
  • Takeover of production outsourcing
  • Production of end-of-life products
  • Procurement of electronic components and necessary materials
  • Development of new manufacturing technologies
  • Cooperation in custom R&D projects