The Companies of Cicor Microelectronics pays particular attention to quality assurance. For realization of the customer's requirements appropriate procedures are used starting in the frame of the design activities up to and including delivery of the finished product (Reliability prediction, worst case analysis, analysis of thermal management, FMEA, in-process-tests, screening, LAT, end test).

Depending on the project-specific requirements, Cicor Microelectronics offers a wide spectrum of different testing procedures. In close coordination with the customer, we undertakes the electrical testing of all base items up to a special 50 GHz HF measurement.


Overview of the testing and inspection procedures:

Realization according to standard specification

• MIL-STD-883
• MIL-PRF-38534
• ESA PSS-01-608
• or to customer specifications.

test procedures:

• Burn-in
• Mechanical shock, vibration, acceleration
• Leak test
• PIND
• RGA
• Thermal cycling
• Moisture resistance
• Workmanship tests (solderability, bondability)
• Radiographic inspection
• Operating live test
• High temperature storage
• Testing of the generic parameters U, I, R, C, f, t
  (RF measurement technique up to 50 GHz)