Rigid

Parameter	Capability
Line width/space	40/40 µm
Blind Vias (laser)	50 µm
Aspect ratio, laser via	1:1
PTH (mechanical)	80 µm
Aspect ratio, via size	26:1, drill diameter >150 µm
Pad diameter mechanical vias	via diameter + 80μm
Pad diameter laser vias	via diameter + 50μm
Min. substrate thickness	50 µm
Max. board thickness	6.5 mm
Max. panel size	692mm x 602mm
Max. board size	645mm x 550 mm
Number of layers	50
Max. copper thickness	170 µm
Min. pitch (via in pad)	0.18 mm
Staggered/stacked microvias	6+n+6
DUT area planarity (100 mm size)	± 12.5 µm
Controlled impedance tolerance	± 5 %
Surface Protection	Liquid solder mask Conformask Coverlay
Surface finishes	Electroless/Electrolytic Ni/Au ENEPIG (NiPdAu) Immersion Tin, Silver, OSP, HASL
Substrate Materials	High TG epoxy, High frequency, Stablcor, CIC, Halogenfree

Our capabilities are constantly evolving.
Do not hesitate to contact us if your application isn't within this range!