Rigid-Flex

Parameter	Capability on Rigid	Capability on flex
Line width/space	40/40 µm	25/25 µm
Blind Vias (laser)	50 µm	40 µm
Aspect ratio, laser via	1:1	1:1
PTH (mechanical)	150 µm	150 µm
Aspect ratio, via size	20:1, drill diameter >150 µm
Pad diameter mechanical vias	via diameter + 200μm	via diameter + 200μm
Pad diameter laser vias	via diameter + 50μm	via diameter + 100μm
Min. substrate thickness	50 µm	25 µm
Max. board thickness	6.5 mm
Max. panel size	580mm x 460mm
Max. board size	537mm x 424 mm
Number of layers	50	6
Controlled impedance tolerance	± 5 %	± 10 %
Surface Protection	Liquid solder mask Conformask Coverlay	Coverlay
Surface finishes	Electroless/Electrolytic Ni/Au ENEPIG (NiPdAu) Immersion Tin, Silver, OSP

Our capabilities are constantly evolving.
Do not hesitate to contact us if your application isn't within this range!