Reel-to-Reel

Parameter	Capability 1 layer	Capability 2 layers
Line width/space	80/80 µm	80/80 µm
Alignement between sides	-	± 50 µm
PTH (laser)	-	100 µm
Blind vias (laser)	-	40 µm
PTH (mechanical)	0.3 mm (stamped)	-
Blind vias (mechanical)	0.3 mm (stamped)	-
Pad diameter	via diameter + 0.15 mm	via diameter + 0.2 mm
Min. thickness	50 µm	50 µm
Max. thickness	0.22 mm	0.22 mm
Reel size	150 m	150 m
Max. board size	150mm x 152mm	150mm x 152mm
Surface protection	Liquid solder mask Conformask Coverlay
Surface finishes	Electroless/Electrolytic Ni/Au ENEPIG (NiPdAu) Immersion Tin, Silver, OSP
Testing	Electrical Test Automated Optical Test

Our capabilities are constantly evolving.
Do not hesitate to contact us if your application isn't within this range!