Polymer Substrates

SUBSTRATES
Materials

• GIL GML 1100
• Rogers RT/duroid-Laminate
• Rogers RO 3000er, 4000er Serie
• Rogers ULTRALAM
• Rogers TMM
• flexboard materials (e.g. Pyralux)
• other materials on request (e.g. Arlon, Taconic)

CONDUCTORS
Materials

• Cu

Dicken

• standard: 17.5 µm / 35 µm

Surfaces

• electroless deposited Ni + Au (solderable and bondable)
• electroplated Au (bondable)
• electroless deposited Sn (solderable)
• OSP-copper
• alpha level

Conductor width & spacing

• min. 50 µm
• tolerance: min. ± 10 µm

TECHNOLOGICAL POSSIBILITIES

• production of multilayers made of different materials (e.g. RO 3003-FR4)
• laminated of polymer substrates on metal base plate (e.g. heat sink)
• plated through holes
• processing of laminates with base plates
• assembly of complete electronic components including electric tests

DELIVERY TIMES FOR PROTOTYPES
10 working days when mask dates are availableinclusive masks, layer production and assembly of electronic components