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In addition to the complete manufacturing of the modules, Cicor Microelectronics also offers the technologies used as individual services. We respond with the greatest degree of flexibility to the most varied of requirements.

Examples of typical individual jobs include wafer sawing or the processing of ceramics.


Ceramics Processing
With a new laser processing system for ceramics, the companies of Cicor Microelectronics are able to offer a high-quality, cost-effective raw ceramic processing service for special electronic applications.

In addition to the scribing and cutting of the ceramic, this facility is also able to produce cavities to sink the bare dice. This enables the bonded wire connections to be created shorter, which again leads to an improvement of the RF performance. Moreover, an optimal thermal dissipation through the thin cavity bottom is possible. This offers a smart and cost-effective alternative to the LTCC or chip carrier solution.

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Wafer Sawing
With the sawing of Si-wafers we has integrated a further important individual process step in chip assembly into the manufacturing profile. The technology and the process flow are optimised to a type variety and therefore are ideally suited for small numbers of pieces or rapid prototyping.

In this way our customers can now benefit from a complete manufacture of electronic devices – from the wafer up to the assembled and tested circuit. Thereby the logistics and communication channels can be arranged more efficiently and the development as well as prototyping times can be reduced.

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