LTCC

TECHNOLOGICAL POSSIBILITIES

• Laser processing of fired LTCC
• Thick film postfiring on LTCC
• Thin film on LTCC
  
  

SUBSTRATES
Materials

• DuPont 951
• other on request
  
  

CONDUCTORS (top level)
Materials

• Thick film, postfiring: AgPd, Au
• Thin film: CrNiCu, TiWAu

Surface

• Thick film: solderable and bondable
• Thin film:
  - electroplated Au (bondable)
  - electroplated Ni+Au (solderable)

Lines & Space

• Thick film: min. 80µm
• Thin film: min. 20µm

Realisation of LTCC manufacturing in cooperation with external partners.