- Automatic assembly of parts and components with high precision microassembly system and integrated solderstation in the MAC
- Plasma cleaning for parts, components and boards
- Fully automatic die bonding, flip chip bonding and assembly with components (e.g. MCM)
- Assembly of ceramic substrates, PCB’s or power components on base plates, in housings with soldering or epoxy (conductive/non-conductive)
- Assembly of substrates and boards on heatsinks and sandwich heatsinks
- Automatic and manual wire bonding: Ball-Wedge, Wedge-Wedge; ultrasonic, thermosonic, Au-/Al-/AlSi-/Pt-wire, thin wire, heavy wire; ribbon bonding
- Beam lead bonding
- Gap welding
- Connecting with standard leadframes (SIL/DIL) customized leadframes, special solutions
- Different types of RF connectors
