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Flex Circuits
| Parameter | Capability |
| Line width/space | 25/25 µm |
| PTH (laser) | 40 µm |
| Blind vias (laser) | 40 µm |
| PTH (mechanical) | 150 µm |
| Pad diameter | via diameter + 0.2 mm |
| Min. thickness | 25 µm |
| Max. thickness | 2.5 mm |
| Max. panel size | 457mm x 305 mm |
| Max. board size | 417mm x 265 mm |
| Number of layers | up to 6 (8 for rigid-flex) |
| Surface protection | Liquid solder mask Conformask Coverlay |
| Surface finishes | Electroless/Electrolytic Ni/Au ENEPIG (NiPdAu) Immersion Tin, Silver, OSP |
| Testing | Electrical Test Automated Optical Test Environmental Tests |
Our capabilities are constantly evolving.
Do not hesitate to contact us if your application isn't within this range!