
The trustworthy technology consultancy provided by the companies of Cicor Microelectronics is the cornerstone of a successful cooperation. The selection of the appropriate assembly and bonding techniques including the packaging technology determines to a great extent the quality and functionality of future microelectronic systems. The development of customized solutions using the state-of-the-art technologies of microsystems engineering techniques takes place in-house at the companies of Cicor Microelectronics.
Through a combination of manufacturing technologies and the utilisation of the corresponding parts as well as packages and carrier materials, customised MCMs, modules or systems can be produced for the most varied of applications and environmental requirements.
Cicor Microelectronics supports its partners by finding a solution to their specific idea.