Complex superstructures, delivery packaging

• Customized hybrid circuits as
  BGA components (3D-BGA)
• HF assemblies with front-side contact to the SMT assembly on the mother board
• unit combinations of ceramic, FR4 and flexboard
• heat dissipation with matched heat sinks (CuW, CuMo, AlSiC, Hivol TM)
• hermetic packaging of confined ceramic board sections
  
  

Delivery packages

• blister reels
• waffle / gel packs
• deep draw packaging
• customized delivery packages