Ceramic laser machining

Milling

Partial milling of ceramic cavities to countersink bare dice

Advantages

• shorter wire bond connections
• optimal heat dissipation

Cutting

Cuttings with any geometries

• to countersink bare dice, in combination with a chip carrier or heatsink
• to realize capacious through holes for power applications

Advantages

• shorter wire bond connection
• optimal heat dissipation

Drilling and Scribing

Drilling of ceramics for high quality holes as well as precise scribe lines with small tolerances
(min. +50 / -25 microns)

Advantages

• narrow profile of the hole edges, slight taper
• excellent metallization of the drilled holes
• improved quality of the scribed edges in comparison to CO2-Laser

Sawing

Sawing of ceramics or other substrates with a wafer saw

Advantages

• sawing of very thin or thick as well as small sized substrates
• outer edges of high quality with close tolerances (±15 microns)