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3D-MID Technology

Capabilities & Technologies

The wish for:

  • Miniaturisation
  • Rationalisation/simplified systems
  • Functionality

The solution:

  • 3D-MID technology

The innovation:

  • The integration of mechanical and electronic functions into a single component in the smallest space

The benefits:

  • Optimal space utilisation
  • High functional integration density
  • Greater design flexibility
  • High flexibility
  • Very reliable
  • Environmentally friendly
  • Savings

The process:

  • Laser Direct Structuring (LDS)
  • 2-component injection moulding (2K)

The offerings:

Development and customer-specific applications for 3D-MID products

Where:

Cicor 3D-MID technology centre, Boudry – from injection moulding, laser and metallization up to Electronic Assembly

The production

In Boudry as well as at subsidiaries of the Cicor Group in Europe and Asia

Application-specific procedures - A comparison of manufacturing processes

There are different processes for creating 3D-MID products. Cicor specialises in two of these: Laser Direct Structuring (LDS) and 2-component injection moulding (2K). LDS has greatly simplified the manufacturing process. Antennae structures, for example, can be integrated directly and cost effectively into mobile phone casings. In medical technology, sophisticated mechatronic systems for applications that integrate mechanical and electrical properties are feasible. 2K is especially convincing where large production runs and complex track runs are involved.

Which process is best suited depends upon the application.

Laser Direct Structuring (LDS)

+ Simple injection moulding tool
+ Layout changes easy to implement
+ Ultra-fine structures possible (150 μm)
- Many process steps (laser structuring, cleaning)
- Areas not accessible to the laser beam cannot be structured or metallized

Application
Where small quantities and a number of layout options are involved

2-component injection moulding (2K)

+ Only 2 process steps to produce the substrate
+ Complex track routing possible
+ Very high reproducibility of the layout
- Complex (costly) injection moulding tool
- Conductor tracks and distances of only ≥ 300 μm possible

Application
Large quantities
Where large surfaces are to be metallized
Where complex structured layouts are involved

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