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Microelectronics

Capabilities & Technologies

We offer you a comprehensive service portfolio with various levels of production depth. Our processes range from technology development to the manufacturing of complex components and modules.

Development

  • Technology consultancy/development
  • Feasibility analyses
  • Component group development
  • Substrates/modules qualification under ESA and MIL standards

Substrate manufacturing

  • Thin-film technology
  • Thin film circuits with integrated resistors and couplers
  • Copper thin film circuits for high-performance applications
  • High precision, high resistance resistors /resistor networks
  • Multilayer circuits on ceramic
  • Copper-filled via circuit boards
  • Flexible multilayer circuits with ultra-high resolution (<10 µm)
  • MEMS

Thick-film technology

  • Various substrates (e.g. Al2O3 or AlN)
  • Various conductor materials (bondable and solderable)
  • Printed resistors (trimmed active/passive)
  • Etched structures (down to 40 µm)
  • Multilayer circuits, DC and RF

Microelectronics assembly

  • Assembly mounting on ceramic, glass and PCBs
  • Component/component group population (all available components)
  • Die attach/COB/Flip-Chip/MMICs
  • Wire/ribbon bonding

Packaging

  • Circuit protection
  • (e.g. passivation, glob-top or conformal coating)
  • Hermetic housing (metal, ceramic)
  • MEMS/RF MEMS packaging
  • Client-specific housing concepts
  • Module mounting including test and screening
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