Capabilities & Technologies

Our specialists can support you throughout all phases of the product lifecycle - from information and consulting in the planning phase, to after-sales services.

We can also provide layout and assembly services through various business partners.

Our services include:

• Consulting
• Manufacturability Evaluation
• Design Analysis
• Special Delivery Requirements
• After-sales Services

We produce prototypes and medium to large series of flexible, rigid-flexible and rigid multilayer PCBs and MCM-Ls using HDI/microvia technology. We also provide double-layer flexible substrates with microvias using reel-to-reel technology.
 
Our solutions fulfill the requirements of advanced applications with high-end IC packages: FC, COF, MCM, COB, CSP, BGA, µBGA and TAB.
 
The variety of applications realized over many years using various base materials provides a solid basis for advising you on the best solution. Efficient applications can be realized using innovative materials, like very thin flex layers  – down to 12.5 µm – and substrates for thermal management or high-frequency.