- Different parts and components: standard SMT (0201), THT, BGA/BGA,QFP, CSP, components for microwave applications, RF connectors, LED‘s, photodiodes, laser diodes, crystals, active and passive optical components
- Automatic and manual Die-Attach: COB for Bare Dies / ASIC’s, wire bonding, Flip-Chip, MIC / MMIC’s processing from wafer or waffle pack
- Solder processes: with flux, with Pb, RoHS compliant, special solder; reflow process, fluxless soldering in vacuum optional with positioning control and with formic acid, inert gas, hydrogen; automatic solder paste printing, solder preforms; repair services for soldered SMT components like BGA or QFP
- Gluing processes: high accuracy automatically dispense, stamp print; thermal/ electrical glue or adhesive foil
