Assembly from different boards, substrates and PCB’s

Thin film substrates (in-house manufacturing) for microwave applications, opto-electronic components and thermal management
Thick film substrates (in-house manufacturing) microwave and power modules
Special RF- and Microwave PCB’s (e.g. Rogers, Taconic, LCP, partial in-house manufacturing)
Standard FR4, rigid, rigid-flex and flex boards as well as multilayer
Combination of different boards and materials in one module
Assembly of board on base plates, on heatsinks and in housings