ADD-ON COMPONENTS
- processing of a wide range of standard styles. including special ones
- SMD (type 0402 ... QFP)
- Chip and wire, COB
- Beam lead
COMPONENT ATTACH
- automatic pick and place
- up to BF 0402
- BGA
- Flip-Chip
- CSP
- MMIC - reflow soldering
- N 2 - die attach
- epoxy
- eutectic
- soldering - wire bonding
- ultrasonic by Al wire
- thermosonic by Au wire
- wire bonding - impulse soldering
- gap welding
TERMINALS TO THE SUBTRATE
- solder lead frames in Single in line, Dual in line or Quad in line style with 0.5 µm/0.63 µm/1.02 µm/1.27 µm/2.5 µm/2.54 µm pitch or customer specific (e.g. wires)
